Advanced packaging: glass substrate/interposer

Glass panel is rapidly emerging as the next-generation substrate/interposer platform due to its thermal stability, resistance to warpage, and large-area compatibility. Leveraging the newly established advanced packaging facilities at Birck, we develop key fabrication building blocks for glass substartes/interposers—including through-glass-via (TGV), redistribution layer (RDL),  flip-chip bonding, etc.—and explore their applications in heterogeneous integration for computing and RF applications.