Advanced Packaging and Semiconductor Lab

Welcome to Advanced Packaging and Semiconductor Lab at Purdue

We innovate at the intersection of semiconductor and advanced packaging to power next-generation microelectronics. For decades, semiconductor scaling has fueled technological progress, yet it is now approaching physical limits. While advanced packaging has emerged as the new engine for scaling, its functionality and integration remain constrained. Our mission is to transcend these boundaries by synergizing emerging semiconductor technologies with chip/system-level packaging for 2.5D/3D integration, to unlock richer functionality, superior performance, yet better energy efficiency for large-scale systems. To advance these breakthroughs from concept to practical realization, we are driven by a co-design approach across the entire stack, from fundamental devices to circuits and complete system integrations.

Interested in working with us?

We are actively seeking Ph.D. and master students to join our lab in Spring/Fall 2026. Ideal candidates will have a strong background in one (or more) of the following areas: micro/nanofabrication, semiconductor devices, or circuit design. Interested candidates are strongly encouraged to contact Prof. Wu with their research interests and CV (canwu@purdue.edu).

News

2025/12 Our lab has officially launched. We have openings for Ph.D., master's, and undergraduate students and postdocs. Reach out to Prof. Wu if you are interested!
2024/10 Our invited paper, entitled "Skin-Inspired Sensors and Integrated Circuits for Wearables and Implantables" is published in 2024 IEEE International Electron Devices Meeting (IEDM), Focus Session on Advanced Neurotechnologies and Human-Machine Interfaces.
2024/7 Can Wu was invited to give a talk at 31st International Workshop on Active-Matrix Flat-panel Displays and Devices, entitled "Enabling High Performance and Strain Insensitivity in Intrinsically Stretchable Carbon-Nanotube Thin-Film Transistors".
2024/3 Our work, on intrinsically stretchable carbon-nanotube thin-film transistors, is published in Nature. For the first time, the performance of stretchable transistors rivals that of conventional flexible ones. This work paves the way for next-generation large-scale, biocompatible electrophysiology sensing tools.

The work is featured in Nature Review Electrical Engineering, IEEE Spectrum, Stanford News, Tech Explore, EurekAlert, Bioengineer, Nature Asia, Mirage News.

2024/3 Our paper, entitled "Strain-Induced Performance Variation in Stretchable Carbon-Nanotube Thin-Film Transistors and the Solution through a Circular Channel Design", is published in IEEE Transactions on Electron Devices (special issue). We develop a simple but effective geometry design to mitigate strain effect on stretchable transistors.
2023/11 Can Wu present a poster in the System X conference at Stanford University, on our recent development of stretchable electronics for human-cyber interfaces.
2023/10 Our paper, entitled "A Monolithic-Integrable Reconfigurable Antenna based on Large-Area Electronics" is published in IEEE Journal of Solid-State Circuits (JSSC).
2023/9 Our paper, entitled "A Device Design Approach to Mitigate Strain Impact on Stretchable Carbon-Nanotube Thin-Film Transistors" is accepted to 2023 IEEE International Electron Device Meeting (IEDM). It is among top ranked student papers!
2023/8 Our proposal on development of a high-density sEMG sensing array is funded.
2023/3 Can Wu shares his perspective on future intelligent sensing as a panelist at the Open House on Nano/Microelectronics workshop at SLAC National Lab.
2022/11 Can Wu a joint talk at the System X conference at Stanford University, on our recent development of stretchable devices and circuits for human-machine interface.
2021/10 A News & Views article in Nature Electronics, entitled "Oxide electronics for 5G and 6G", reviews our work on a gigahertz large area electronics-based phased array.
2021/10 Our work on a gigahertz large-area electronics-based phased array is published online in Nature Electronics.
2021/8 Can Wu Stanford University as a postdoc. My research will focus on developing stretchable electronic for electrophysiological-sensing tools for human-machine interface applications.
2021/7 Can Wu is invited to give a talk at 28th International Workshop on Active-Matrix Flat-panel Displays and Devices, entitled "Gigahertz Large-Area Electronic Devices and Circuits for Wireless Applications".
2021/3 Our work on REITS, a wireless system to improve radar-signal reflections for enhancing self-driving vehicle safety, is reported on NewScientist.
2020/12 Can Wu present our work on gigahertz large-area electronics RF switch and its application to reconfigurable antennas at IEEE International Electron Devices Conference (IEDM).

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